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ABKFPC0523X
PITCH： 0.5mm
Structure：Back lift
0.5-23 Series-0.5mm FPC
CONN.ZIF R/A SMT, Backflip,
H=1.05 Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.04Ω
Withstanding Voltage: 50OV,AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature: -40℃-85℃
Material :
Contact: Copper Alloy
Plating: Au over Ni
lInsulator:High Temperature Thermoplastic(UL94V-0)
CONN.ZIF R/A SMT, Backflip,
H=1.05 Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.04Ω
Withstanding Voltage: 50OV,AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature: -40℃-85℃
Material :
Contact: Copper Alloy
Plating: Au over Ni
lInsulator:High Temperature Thermoplastic(UL94V-0)
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