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ABKFPC05GX
PITCH： 0.5mm
Structure：Back lift
0.5G Series-0.5mm FPC
CONN. ZIF R/A SMT, Backflip,
H=2.7, Dual Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage:50OV,AC/Minute
Voltage Rating:50v,AC,DC
Operation Temperature:-25℃-85℃
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
CONN. ZIF R/A SMT, Backflip,
H=2.7, Dual Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage:50OV,AC/Minute
Voltage Rating:50v,AC,DC
Operation Temperature:-25℃-85℃
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
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