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ABKFPC1017X
PITCH： 1.0mm
Structure：Front flip
1.0-17 Series-1.0mm FPC
CONN.ZIF SMT, Flip,
H=2.4 Dual Bottom Contact
Current Rating: 1.0AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage: 500V,AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature:-40°℃-85℃
Material:
Contact: Copper Alloy
Plating: Au over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
CONN.ZIF SMT, Flip,
H=2.4 Dual Bottom Contact
Current Rating: 1.0AMP
Insulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage: 500V,AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature:-40°℃-85℃
Material:
Contact: Copper Alloy
Plating: Au over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
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