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ABKFPC0509X
PITCH： 0.5mm
Structure：Front flip
0.5-0.9 Series-0.5mm FPC
CONN.ZIF R/A SMT, Flip,
H=2.4,Dual Bottom Contact
Current Rating: 0.5AMP
lInsulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage:50OV,AC/Minute
Voltage Rating: 50v,AC,DC
Operation Temperature: -40C-105℃
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
CONN.ZIF R/A SMT, Flip,
H=2.4,Dual Bottom Contact
Current Rating: 0.5AMP
lInsulation Resistance:≥500MΩ
Contact Resistance:≤0.03Ω
Withstanding Voltage:50OV,AC/Minute
Voltage Rating: 50v,AC,DC
Operation Temperature: -40C-105℃
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator: High Temperature Thermoplastic(UL94V-0)
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