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ABKFPC0514X
PITCH： 0.5mm
Structure：Back lift
0.5-14 Series-0.5mm FPC
CONN. ZIF R/A SMT, Backflip,
H = 1.2 Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance: >500MΩ
Contact Resistance: C0.03Ω
Withstanding Voltage: 500V.AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature： -25℃-85 C
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator： High Temperature Thermoplastic(UL94V-0)
CONN. ZIF R/A SMT, Backflip,
H = 1.2 Bottom Contact
Current Rating: 0.5AMP
Insulation Resistance: >500MΩ
Contact Resistance: C0.03Ω
Withstanding Voltage: 500V.AC/Minute
Voltage Rating: 50v, AC,DC
Operation Temperature： -25℃-85 C
Material:
Contact: Copper Alloy
Plating: Sn over Ni
Insulator： High Temperature Thermoplastic(UL94V-0)
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